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Guangdong Taijin Semiconductor Technology Co., Ltd

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City:dongguan

Province/State:guangdong

Country/Region:china

Contact Person:MrZhao

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High Productivity Semiconductor Packaging Equipment Chip Molding Device

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Chip Molding Device 【Performance Parameters】 ● Model pressure: 98-1764kn; ● injection molding pressure: 4.9-29.4kn can be adjusted; ● Applicable lead ...

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fabrication pcb algerie electronic product packaging design best software for packaging design

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