Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
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2 Years
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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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Semiconductor Industry IC Packaging Equipment Chip Molding System Automated

Semiconductor Industry IC Packaging Equipment Chip Molding System Automated
  • Semiconductor Industry IC Packaging Equipment Chip Molding System Automated
  • Semiconductor Industry IC Packaging Equipment Chip Molding System Automated
  • Semiconductor Industry IC Packaging Equipment Chip Molding System Automated
Products Detailed
Chip Molding System Semiconductor packaging equipment is mainly used in TO, SOP, SSOP, TSSOP, DIP, SOT, ESOT, SOD, QFN, SMA, SMC, SMBF, MBF, JA, QFP, ...
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