Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
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2 Years
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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient

Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient
  • Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient
  • Chip Encapsulation System Semiconductor Fab Equipment Energy Efficient
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Auto Chip Encapsulation System Technical Parameters: Attribute Value Product Type Molding Equipment Application Semiconductor Industry Precision High ...
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