Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
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Auto Mold System
Features
● Automatic molding press also known as automatic molding machine, automatic molding chips, semiconductor devices and other products;
● Full servo control system, PLC (Omron) + controller;
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
● Equipped with vision system to recognize the feeding direction;
● WIN10 + 15 inch touch screen + touch keyboard;
● CCD image detection, feeding anti-reverse detection;
● Optional mold vacuum function, isolation mold function, detection function after plastic sealing;
● Use of imported raw materials, high precision, stable performance, high service life, quality assurance;
● Customized on demand, permanently provide quality service.
Technical Parameters:
| Type | Vertical Injection Molding Machine |
| Control System | PLC |
| Model | SM-1000 |
| Cooling System | Water |
| Weight | 5 Tons |
| Clamping Force | 1000KN |
| Capacity | 100 Tons |
| Screw Diameter | 35 Mm |
| Max. Mold Height | 400Mm |
| Injection Pressure | 200 Mpa |
| Auto Transfer Molding | Yes |
| Auto Packaging Equipment | Yes |
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).