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Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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2 Years
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Home / Products / Semiconductor Molding Machine / ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine /

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Semiconductor Molding Machine

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Trim And Form Machine

 [25]

IC Lead Frame Stamping Mold

 [19]

MGP Mold

 [30]

Trimming Forming Dies

 [25]

Mold Chase

 [6]

Semiconductor Molding Equipment

 [25]

Chip Sorting Machine

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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine
ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine
  • ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine
  • ISO9001 Semiconductor Molding Machine Chip Injection Transfer Moulding Machine
Products Detailed
Auto Chip Transfer Molding Performance Parameters: ● Mold closing pressure: 98-1764kN; ● Injection pressure: 4.9-30kN adjustable; ● Applicable ...
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Product Tags:
bmc injection molding machine silicon injection moulding machine injection molding processing guide

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