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Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
Verified Supplier
2 Years
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Home / Products / Semiconductor Molding Machine / Automatic Semiconductor Packaging Equipment With Water Cooling System /

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Product Categories

Semiconductor Molding Machine

 [25]

Trim And Form Machine

 [25]

IC Lead Frame Stamping Mold

 [19]

MGP Mold

 [30]

Trimming Forming Dies

 [25]

Mold Chase

 [6]

Semiconductor Molding Equipment

 [25]

Chip Sorting Machine

 [25]
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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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Automatic Semiconductor Packaging Equipment With Water Cooling System
Automatic Semiconductor Packaging Equipment With Water Cooling System
  • Automatic Semiconductor Packaging Equipment With Water Cooling System
Products Detailed
Max. Mold Height of 400 Mm Auto Packaging Equipment with Water Cooling System Product Description: Semiconductor Molding Machine - Product Overview ...
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Product Tags:
water cooled package unit system water cooled package unit automatic thermoforming packing machine

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