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Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
Verified Supplier
2 Years
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Home / Products / IC Lead Frame Stamping Mold / Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength /

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Product Categories

Semiconductor Molding Machine

 [25]

Trim And Form Machine

 [25]

IC Lead Frame Stamping Mold

 [19]

MGP Mold

 [30]

Trimming Forming Dies

 [25]

Mold Chase

 [6]

Semiconductor Molding Equipment

 [25]

Chip Sorting Machine

 [25]
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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength
Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength
  • Hardness HRC50-60 Lead Frame IC Mold With NAK80 Material High Strength
Products Detailed
Product Description: High-Life IC Lead Frame Mold This is a product overview for High-Life IC Lead Frame Mold, a high-precision and high-life mold ...
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Product Tags:
ss 316 material composition grade k55 steel casing material cem-1 pcb

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