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Semiconductor Molding Machine

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IC Lead Frame Stamping Mold

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Guangdong Taijin Semiconductor Technology Co., Ltd

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City:dongguan

Province/State:guangdong

Country/Region:china

Contact Person:MrZhao

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Aluminum DIP29 MGP Mold With Surface Polishing High Rigidity

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DIP29 MGP Mold Main packaging form To series: T0220/263/247/252/3p, etc.; SOP series: SOP4/6/8/8/1 0/12/14/16/20/28;; DIP series: DIP4/8/14/16/18/23...

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polishing anodized aluminum anodizing polished aluminum aluminum extrusions anodized

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