Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
Verified Supplier
2 Years
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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating

DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating
  • DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating
  • DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating
  • DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating
  • DIP4/8/14/16/18/23/24/25/29/40 MGP Mold DME Base Nickel Plating
Products Detailed
DIP4/8/14/16/18/23/24/25/29/40 MGP Mold Features: Product Name: IC Lead Frame Stamping Mold Mold Material: NAK80, S136, SKD61, Etc. Surface Treatment: ...
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