Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
Verified Supplier
2 Years
Home / Products / MGP Mold / QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling /

show pictures

Contact Now
Guangdong Taijin Semiconductor Technology Co., Ltd
Visit Website
City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
Contact Now

QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling

QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling
  • QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling
  • QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling
  • QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling
  • QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling
  • QFP/IPM Series MGP Mould For Chip Packaging Water Cooling Or Air Cooling
Products Detailed
QFP/IPM Series MGP Mold Product Description: MGP Mold - High-Quality Mold for Electronic Products MGP Mold is a highly efficient and durable mold ...
View Products Detailed →