Guangdong Taijin Semiconductor Technology Co., Ltd
A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold
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Clamping pressure: 98-1764kN
Injection pressure: 4.9-29.4kN
Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm
Applicable EMC specifications: Diameter: Ф 11-Ф20mm (±0.2mm), length/diameter=1.2-2.0(Max 35mm)
Control system: PLC (Omron)+ host computer
Operating system: WIN10+15-inch touch screen + touch keyboard
Detection system: CCD image detection, feed anti-reverse detection
Loader: aluminum magazine
Unloader: auto stack load to box receiving
Optional: mold vacuum system, separator film system
environmental parameter requirements:
1. Temperature range: 22-28 degrees Celsius;
2. Humidity range: 50%-75%;
3. Cleanliness level of the workshop: 100,000 grade;
Equipment volume and load characteristics:
1. Equipment dimensions and weight:
| Overall dimensions (mm) L x W x H | Dimensions after door opening (mm) Lmax * Wmax * Hmax | Equipment weight (T) | |
| With 1 press | 2400*1800*2100 | 3800*3300*2100 | 4 |
| Equipped with 2 presses | 3000*1800*2100 | 4400*3300*2100 | 5.8 |
| Equipped with 3 presses | 3600*1800*2100 | 5000*3300*2100 | 7.6 |
| Equipped with 4 presses | 4200*1800*2100 | 5600*3300*2100 | 9.4 |
Foundation use requirements:
Bearing capacity 2 tons/square meter;
Equipment connection requirements:
1. Equipment power:
| Voltage | Power ( kW) | Cable size( mm2) | |
| With 1 press |
AC 380V 50/60HZ | 15 | 6 |
| Equipped with 2 presses | 23 | 10 | |
| Equipped with 3 presses | 31 | 16 | |
| Equipped with 4 presses | 39 | 16 |
2. Gas requirements:
3. Cooling system: Not required
4. Exhaust ventilation requirements: 150mm ventilation pipe