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Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

Manufacturer from China
Verified Supplier
2 Years
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Home / Products / Semiconductor Molding Machine / 120 Tons Auto Molding System With 12KW Heating Power /

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Semiconductor Molding Machine

 [25]

Trim And Form Machine

 [25]

IC Lead Frame Stamping Mold

 [19]

MGP Mold

 [30]

Trimming Forming Dies

 [25]

Mold Chase

 [6]

Semiconductor Molding Equipment

 [25]

Chip Sorting Machine

 [25]
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Guangdong Taijin Semiconductor Technology Co., Ltd
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MrZhao
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120 Tons Auto Molding System With 12KW Heating Power
120 Tons Auto Molding System With 12KW Heating Power
  • 120 Tons Auto Molding System With 12KW Heating Power
Products Detailed
Clamping pressure: 98-1764kN Injection pressure: 4.9-29.4kN Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1...
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